- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/498 - Leads on insulating substrates
Patent holdings for IPC class H01L 23/498
Total number of patents in this class: 16017
10-year publication summary
1257
|
1503
|
1540
|
1601
|
1660
|
1633
|
1518
|
1537
|
1739
|
834
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
2158 |
Intel Corporation | 45621 |
1270 |
Samsung Electronics Co., Ltd. | 131630 |
1183 |
Advanced Semiconductor Engineering, Inc. | 1546 |
397 |
Qualcomm Incorporated | 76576 |
344 |
Micron Technology, Inc. | 24960 |
280 |
STATS ChipPAC Pte. Lte. | 1516 |
271 |
Infineon Technologies AG | 8189 |
267 |
Shinko Electric Industries Co., Ltd. | 1186 |
252 |
International Business Machines Corporation | 60644 |
251 |
Invensas Corporation | 645 |
236 |
Texas Instruments Incorporated | 19376 |
219 |
Murata Manufacturing Co., Ltd. | 22355 |
201 |
Fuji Electric Co., Ltd. | 4750 |
196 |
Mediatek Inc. | 4584 |
183 |
Siliconware Precision Industries Co., Ltd. | 489 |
176 |
Renesas Electronics Corporation | 6305 |
175 |
Mitsubishi Electric Corporation | 43934 |
170 |
Amkor Technology Singapore Holding Pte. Ltd | 314 |
159 |
Rohm Co., Ltd. | 5843 |
145 |
Other owners | 7484 |